• Mechanical Engineering Intern

• Kulim |    May 26, 2021 Intel
• electronic
  Share |  Save this job
  Share this job on -

  [x]

• Engineering Intern

• Kulim |    Feb 19, 2021 Intel
• electronic
  Share |  Save this job
  Share this job on -

  [x]

• Packaging R&d Engineer

• Kulim |    Jan 28, 2021 Intel
• Intel - Kulim, Kedah - Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance
  Share |  Save this job
  Share this job on -

  [x]

• Mechanical Engineering Intern

• Kulim |    Jan 12, 2021 Intel
• electronic
  Share |  Save this job
  Share this job on -

  [x]

• Yield Intern

• Kulim |    Oct 25, 2020 Intel
• Intel - Kulim, Kedah - Yield analytic engineering intern in developing yield signal detection capability/system for new electronic packaging technology assembly and test
  Share |  Save this job
  Share this job on -

  [x]

Advertisement

---